View Enquiry List Enovate3D
Enovate3D is the first start-up business spin off from Westlake University School of Engineering. We offer our customers customized electronic additive manufacturing solutions based on the original and industry-leading micrometer and sub-micrometer ultra-high-precision electronic additive manufacturing technology. Our self-developed 1-10 micrometer precision electronic additive manufacturing equipment can produce ultraprecise three-dimensional architectures using a variety of functional materials including metallic conductive materials, polymer and ceramic-based dielectric materials, optical and magnetic materials.
Our application domains address the needs of industrial-scale mass production and encompass both present-day and future-generation mainstream integrated circuit system applications. Our products and solutions are being used in a variety of industries, including displays, semiconductor packaging, lithium-ion batteries.
Electronics additive manufacturing equipment is primarily applied in industries such as display, semiconductor packaging, and lithium batteries, enabling the printing of micro/nano-scale functional structures with feature sizes down to 1-10 μm. enovate3D’s electronic additive manufacturing platform employs Direct Ink Writing (DIW) technology combined with proprietary nano-scale ink materials, achieving 3D printing of high-performance metallic conductive materials, polymers, and composite dielectric materials. This system is capable of printing ultrafine interconnects, passive components, microwave electronics, flexible circuits, and 3D circuitries. Users can achieve software-driven automated printing based on CAD data or parametric programming, ensuring high flexibility in manufacturing processes.
Electronics additive manufacturing equipment is primarily applied in industries such as display, semiconductor packaging, and lithium batteries, enabling the printing of micro/nano-scale functional structures with feature sizes down to 1-10 μm. enovate3D’s electronic additive manufacturing platform employs Direct Ink Writing (DIW) technology combined with proprietary nano-scale ink materials, achieving 3D printing of high-performance metallic conductive materials, polymers, and composite dielectric materials. This system is capable of printing ultrafine interconnects, passive components, microwave electronics, flexible circuits, and 3D circuitries. Users can achieve software-driven automated printing based on CAD data or parametric programming, ensuring high flexibility in manufacturing processes.
