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Photoresist Coating System - SPT200
This photoresist deposition system is engineered to deliver high‑uniformity thin‑film coatings across a wide range of semiconductor wafer topographies. Unlike traditional high‑speed spin coating, this system ensures consistent resist coverage on deep wells, trench structures, and high‑aspect‑ratio features, making it ideal for MEMS, sensors, power devices, and 3D wafer architectures.
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Designed for 100 mm, 150 mm, 200 mm, and optional 300 mm wafers, the system provides a complete solution for fabs and R&D labs requiring precise and repeatable coating performance. Its advanced ultrasonic spray technology enables superior film uniformity, reduced material waste, and improved control over coating thickness across challenging substrate surfaces.
This platform is an ideal choice for semiconductor engineers seeking a high‑performance, low‑maintenance, and highly flexible alternative to spin coating for next‑generation wafer processing.
