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This photoresist deposition system is engineered to deliver high‑uniformity thin‑film coatings across a wide range of semiconductor wafer topographies. Unlike traditional high‑speed spin coating, this system ensures consistent resist coverage on deep wells, trench structures, and high‑aspect‑ratio features, making it ideal for MEMS, sensors, power devices, and 3D wafer architectures.
NovoCoat™ is an automated ultrasonic coating system delivering uniform, repeatable thin films for semiconductor wafers, R&D, and production.
