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POLOS Advanced 200 are suitable for processing fragments of Ø 200 mm / 8 inch wafers (or Ø 260 mm substrates), or 6"x6" square substrates.
The POLOS Advanced 300 spin coater is suitable for processing fragments of Ø300mm/12 inch wafers (or Ø360mm substrates), or 8"x8" square substrates.
